Fabrication process of LED
The Fabrication process consists of shaping the chip and forming electrical contacts (electrodes).
One of the key issues for fabrication LED chips is how to extract lights from the MQW into the air. Fabrication technologies employed by SSC consist of ohmic contact formation, chip shaping,, transparent electrode deposition, photolithgraphy, etching, metal electrode deposition, backside polishing and chip dicing (scribing/breaking).
These LED chips are estimated and binned after the fabrication process. Wall plug efficiency (optical output power/source power) is one of the main factors to define chip performance of LED. Numerous R&D technologies are carried out in order to improve efficiency such as materials research, electrodes'shapes, optical and electrical design.
